---
title: "How Google, Meta, and Microsoft Are Reshaping the Optical Transceiver Industry"
slug: "google-meta-microsoft-optics-strategy"
type: analysis
category: "Market & Procurement"
tags: [hyperscale, Google, Meta, Microsoft, silicon photonics, CWDM4, co-design, Jericho, Ariel, 400G, compatible transceivers]
seo_focus_keyword: "hyperscale optics strategy Google Meta Microsoft silicon photonics"
---

When Google, Meta, and Microsoft make optical transceiver decisions, they don't call their account manager at Cisco. They employ optical engineers who co-design modules with transceiver manufacturers, publish specifications that become industry standards, and invest in silicon photonics startups whose technology shows up in products sold to everyone else two or three years later. The scale of their influence on the transceiver market is larger than most people outside the hyperscale ecosystem appreciate.

## Co-Design Programs and What They Actually Produce

The term "co-design" gets used loosely. What it means in practice for hyperscalers is that their optical engineers sit in the same design reviews as the transceiver manufacturer's engineers and jointly define the module specification. The hyperscaler is not a passive customer specifying requirements — they're active participants in component selection, PCB layout decisions, and qualification methodology.

Google's custom optical module program produced several generations of modules under the internal "Ariel" project name, targeting high-lane-count coherent interfaces for data center interconnect. The Ariel coherent module program drove integration of Acacia's AC400 DSP into a form factor that was smaller and more power-efficient than what the merchant silicon market was offering. Several elements of the Ariel specification subsequently influenced what Acacia shipped as a commercial product.

Microsoft's involvement in the CWDM4 MSA is more direct. Microsoft Azure engineers were among the co-authors of the CWDM4 MSA in 2014, which defined the four-wavelength CWDM approach for 100G at 2km reach. The motivation was cost: Microsoft's Azure buildout was facing significant optical module BOM costs with the LR4 approach using directly modulated lasers at precise wavelengths. CWDM4's relaxed wavelength accuracy requirements and simpler transmitter design translated to a roughly 40% reduction in module cost at volume. Since Azure was operating at a scale where even small per-port cost reductions generated eight-figure annual savings, the engineering investment in co-authoring the MSA was rational.

Meta (then Facebook) drove the OpenOptics MSA for 400G data center interconnect, and their engineers contributed heavily to the QSFP-DD electrical specification. Meta's data center interconnect requirements — specifically the need for 400G over 2km SMF between buildings in their campus-style data centers — pushed the 400G DR4 specification (four lanes at 100G each, 1310nm range, PSM4 multiplexing) into broader market availability. DR4 is now a standard product from compatible vendors and a mainstream choice for 400G campus DCI applications.

## The Silicon Photonics Push

All three major hyperscalers are actively investing in silicon photonics, and the reasons go beyond cost. Silicon photonics integrates optical components — waveguides, modulators, detectors — onto silicon wafers using CMOS-compatible processes. The manufacturing leverage of semiconductor fabs (versus the artisan-like processes of compound semiconductor photonics) is the long-term economic target.

Intel's silicon photonics program, long the most mature commercial offering, now supplies 100G and 400G PSM4 modules that are co-packaged with switch ASICs in some hyperscale designs. The co-packaged optics concept — where the optical engine is integrated directly with the ASIC package rather than in a separate pluggable — eliminates the electrical interface between ASIC and transceiver, reducing SerDes power consumption and enabling higher aggregate bandwidth density.

Google has invested in Ayar Labs, which is developing chiplet-scale optical interconnects that integrate directly with processor packages. The Ayar Labs TeraPHY chiplet is an optical I/O component designed to provide 2 Tbps of bandwidth in both directions using optical fiber connections directly to the processor package. This represents a fundamental departure from the pluggable form factor model that has dominated optical networking for 20 years. It's not a 2026 problem for most networks, but it defines the technology direction that will shape the pluggable market over the next decade.

Microsoft has made investments in Lumentum and is a customer of Marvell's Colorbeam silicon photonics program, which targets integration of coherent optical engines into co-packaged optics for the next generation of Azure data center interconnect. The Marvell Orion DSP, which powers several 400G ZR+ modules in the market, is a direct result of the hyperscale DCI requirements that Microsoft and others specified.

## What This Means for the Compatible Market

The hyperscale investment in silicon photonics and co-packaged optics is creating a bifurcation in the transceiver market. At the very high end — co-packaged optics integrated with ASICs, operating at terabit densities — the market will be driven by hyperscale-specific designs that never appear as discrete pluggable products. This segment is not a compatible transceiver opportunity.

The pluggable market, however, benefits from hyperscale investment in a different way. When Google and Microsoft drive the CWDM4 or DR4 or 400G ZR specifications, they create standardized modules that multiple manufacturers can produce. This is exactly the condition the compatible transceiver market depends on: standardized interfaces with known EEPROM structures and known performance parameters, manufacturable by second-tier vendors at volume.

The compatible market's position in 400G is stronger partly because hyperscalers drove standardization before OEM vendors could establish proprietary lock-in. 400G QSFP28 SR4 (using the same 4x100G PSM4 physical layer as DR4, but for multimode) is available from dozens of manufacturers and from compatible vendors at prices that reflect commodity manufacturing costs, not OEM markup. This is the downstream effect of hyperscale standardization activity.

## The Jericho Networking ASIC Connection

The Jericho designation refers to Broadcom's Jericho and Jericho2 network forwarding ASICs, which are the line card ASICs used in Cisco, Juniper, Nokia, and others' carrier routing platforms. The relevance to optics is that hyperscalers influenced the optical interface specifications of Jericho2 by communicating directly with Broadcom about the port densities and SerDes lane rates they needed for co-packaged optics programs. Major equipment vendors who buy Jericho2 inherit the optical interface choices that were influenced by hyperscale requirements.

This is a subtle but important mechanism: hyperscalers influence the transceiver ecosystem not only through their direct procurement but through their engineering relationships with semiconductor vendors whose chips are used in equipment that everyone else buys. When Broadcom designs SerDes lanes capable of 112G PAM4 to meet hyperscale co-packaged optics requirements, those same lanes enable 400G QSFP-DD and 800G OSFP in the enterprise and service provider equipment that uses the same ASIC.

The practical upshot for the broader optical market is that the technology trajectory for transceiver speeds, form factors, and integration levels is being set by a small number of organizations with very large-scale requirements, and the rest of the market inherits those decisions. This is not a new dynamic — it has been true since the GBIC era — but the pace and scale of hyperscale influence has accelerated significantly since the 100G transition.
